Co-Packaged Optical Engine
A compact photonic engine concept for short-reach, high-bandwidth xPU interconnect and package-aware optical coupling.
We create silicon photonic SoC products and modules for data-communication and metrology applications. We offers the opportunity to empower collaborating companies to develop advanced, high-performance systems in different industrial field.
Silicon photonics, low-loss optical coupling, and package-aware design help bring high-density optical links closer to compute.
Our team is formed with engineers with advanced degrees and industrial experience in photonic IC design, advanced packaging and product developing
Stable funding support enables long-horizon photonic product development, prototype validation, and industrial scale-up.
We work closely with our customers to provide the custom photonic solutions which can create innovative solutions that brings their product across generations, with the help of photonic ICs.
Each path is designed around practical system integration: package-aware photonics, stable alignment, and validation support for prototypes and early product directions.
A compact photonic engine concept for short-reach, high-bandwidth xPU interconnect and package-aware optical coupling.
A silicon photonic sensing platform for compact optical measurement systems and application-specific optical paths.
Packaging workflows for customers developing photonic chips, modules, evaluation systems, and early-stage validation plans.